online high-speed three-dimensional solder paste detection system
Name : online high-speed three-dimensional solder paste detection system
Model : BDU SPI-510
Specification : monorail
Size : 510 x 505 mm board size; 480 x 490 mm test area
Unit : pcs
Product features:
◆ Single-track high-speed three-dimensional solder paste detection system
◆ PSLMPMP Programmable Phase Contour Modulation Measurement Technology
◆ Test items : volume, area, height, XY offset, shape
◆ Poor detection type : misprint, tin offset, bad shape
◆ Minimum detection element : 01005 ( inch )
◆ Precision : XY direction < 10um; height = 0.37um
◆ Repeatability accuracy : height < 1um (4sigma ); area / volume < 1 % ( 4 sigma )
◆ 510 x 505 mm PCB board size; 480 x 490 mm Detection area
◆ Ultra-high frame number and high precision industrial camera
◆ Detection speed : 0.35 seconds / FOV
◆ Mark point identification : 0.3 seconds /
◆ Maximum detection height : + / -450um ( + /-1200um for option )
◆ RGB Tune patented technology
◆ D-Lighting patented technology
◆ Dynamic profiling function with static anti-warping function
◆ The function of bar code recognition is matched with the function of three points
◆ Full closed loop control function of printing press
◆ Placement Machine Badmark Transmission Function
◆ Access to IMS System Functions
◆ Operating System : windows Seven Professional ( 64 Bit )
◆ Five-minute programming, one-click operation
◆ SPC Process Control
